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Journal of Intelligent Material Systems and Structures


eISSN: 15308138 | ISSN: 1045389X | Current volume: 37 | Current issue: 3 Frequency: 20 Times/Year

The Journal of Intelligent Materials Systems and Structures is an international peer-reviewed journal that publishes the highest quality original research reporting the results of experimental or theoretical work on any aspect of intelligent materials systems and/or structures research also called smart structure, smart materials, active materials, adaptive structures and adaptive materials.

Each submitted article is assigned to an associate editor chosen according to the submitted paper's topic. The associate editor then sends the manuscript to 3 researchers who have expertise in the technical topic of the manuscript.

These reviewers' names are not known to the author according to the single blind system. We encourage our reviewers to respond within 6 weeks of submission.

This journal is a member of the Committee on Publication Ethics (COPE).

Submit your manuscript today at https://mc.manuscriptcentral.com/jimss.

 

The Journal of Intelligent Materials Systems and Structures is an international peer-reviewed journal that publishes the highest quality original research reporting the results of experimental, numerical, or theoretical work in the multidisciplinary engineering field in intelligent material systems and/or structures research (also called smart materials, active materials, adaptive materials, smart structures, and adaptive structures) for various engineering functionalities, such as sensing, actuation, & control, vibration & noise mitigation, wave steering & manipulation, shape reconfiguration, morphing & deployment, energy harvesting, structural health monitoring, and many others. It covers all types of emerging passive, semi-active, and active materials, devices & systems, from responsive or functional materials & structures, to architected materials-based metastructures, to materials & structures embodied with mechanical intelligence and physical computing. 

Each submitted article is assigned to an associate editor chosen according to the submitted paper's topic. The associate editor then sends the manuscript to 3 researchers who have expertise in the technical topic of the manuscript.

This reviewers names are not known to the author according to the single blind system. We encourage our reviewers to respond within 3 weeks of submission.

Editor-in-Chief
Kon-Well Wang University of Michigan, USA
Managing Editor
Christelle Prigent SAGE Publishing, UK
Associate Editors
Andres F. Arrieta Purdue University, USA
Adrien Badel Université de Savoie, France
Xian-Xu 'Frank' Bai Hefei University of Technology, China
Mark J. Balas Emery Riddle University, USA
Theocharis Baxevanis University of Houston, USA
Gregory P.Carman University of California, Los Angeles, USA
Seung-Bok Choi The State University of New York at Korea (SUNY Korea), Korea
Manuel Collet Ecole Centrale de Lyon, France
Marcelo Dapino The Ohio State University, USA
Roland De Breuker Delft University of Technology, Netherlands
Mohammad Elahinia University of Toledo, USA
Grace Gu University of California, USA
Jae-Hung Han KAIST, South Korea
Hongli Ji Nanjing University of Aeronautics and Astronautics, China
Haluk E. Karaca University of Kentucky, USA
Francesco Lanza di Scalea University of California San Diego, USA
Jinsong Leng Harbin Institute of Technology, China
Suyi Li Virginia Tech, USA
Weihua Li University of Wollongong, Australia
Yancheng Li University of Technology Sydney, Australia
Junrui Liang ShanghaiTech University, China
Wei-Hsin Liao The Chinese University of Hong Kong, China
Carlos De Marqui Junior University of Sao Paulo, Brazil
Marcias Martinez Clarkson University, USA
Hani Nauguib University of Toronto, Canada
Mostafa Nouh University at Buffalo, USA
Roger Ohayon Conservatoire National des Arts et Métiers, France
Wieslaw Ostachowicz Polish Academy of Sciences, Poland
Morvan Ouisse FEMTO-ST Applied Mechanics, France
Osman Ozbulut University of Virginia, USA
Gyuhae Park Chonnam National University, South Korea
Michael Philen Virginia Polytechnic Institute and State University, USA
Siddiq Qidwai National Science Foundation, USA
Dimitris A. Saravanos University of Patras, Greece
Ramin Sedaghati Concordia University, Canada
Gary D Seidel Virginia Tech, USA
Shima Shahab Virginia Tech, USA
Ralph C Smith North Carolina State University, USA
Henry A. Sodano University of Michigan, USA
Tyler Tallman Purdue University, USA
Jiong Tang University of Connecticut, USA
Lihua Tang University of Auckland, New Zealand
Serife Tol University of Michigan, USA
Thomas Wallmersperger Technische Universitat Dresden, Germany
Gang Wang The University of Alabama in Huntsville, USA
Ya Wang Texas A&M, USA
Aimy Wissa Princeton University, USA
Zhengbao Yang Hong Kong University of Science and Technology, Hong Kong
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